世界の半導体材料市場データ

Abstract

Overview

The Material Market Data Subscription includes current revenue data along with two years of historical data and a three-year forecast. Each material segment reports revenue for seven market regions (North America, Europe, ROW, Japan, Taiwan, Korea, and China). The report now features detailed historical data for: silicon, photoresist, photoresist ancillaries, process gases and leadframes.

Materials Covered

• Fab Materials
  • Silicon
  • SOI
  • Photomasks
  • Resist
  • Ancillaries
  • Gases
  • Chemicals
  • Targets
  • CMP
  • Others
• Packaging Materials
  • Leadframes
  • Substrates
  • Bonding Wire
  • Die Attach
  • Mold Compounds/Encapsulants
  • Ceramic Packages
  • Others

Methodology

Data is compiled from actual inputs by material suppliers from around the world. Key categories are updated each quarter with data supplied by participating semiconductor material companies to an independent third-party accounting firm, guaranteeing confidentiality of company specific information. The report is offered in an Excel workbook file organized by material type and region.

The purchase of this Subscription now includes the following reports:

SEMIR Silicon Reclaim Wafer Characterization Report

• Publication Date: March 2008
• Principal Analyst: Lara Chamness, SEMI
• Format: .pdf

SEMIR Photomask Characterization Summary

• Publication Date: March 2008
• Principal Analyst: Lara Chamness, SEMI
• Format: .pdf

SEMIR Silicon-on-Insulator (SOI) Wafer Characterization Summary

• Publication Date: May 2008
• Principal Analyst: Lara Chamness, SEMI
• Format: .pdf