世界の高速コネクター市場の進化

Abstract

Bishop and Associates, Inc. has just released a new 15 chapter research report providing a complete analysis of Evolving High-Speed Connectors. This new report details backplane, midplane, and mezzanine connectors as well as high-speed backplane cable assemblies. Connector values are provided for each category for the years 2004, 2005, 2006, and 2010, as well as each region of the world.

The market for high-speed connectors has experienced extensive changes over the past two years from both the technology, as well as business perspectives. This report includes background information on the evolution of high-speed circuits and connectors, and includes data on key electrical and mechanical characteristics for each of the leading interfaces on the market today. The influences of printed circuit board designs, materials, and advanced silicon chips on multigigabit circuit performance are reviewed. Advances in circuit modeling and simulation along with performance testing methods are also covered. Common applications as well as the future direction of the market is discussed along with statistical data on market size and forecasts by bandwidth, end user, and region of the world.

Table of Contents

Chapter 1 - Report Scope and Methodology

• Report objectives
• Study methodology
• Data collection forms
• Connector manufacturer survey
• Connector user survey

Chapter 2 - Introduction and Definitions

• Preface
• Introduction
• Connector definitions / technologies

Chapter 3 - High Speed Connector Basics

• Common backplane architectures
• High-speed transmission line issues
• Defining features of high speed connectors
• The second sourcing imperative
• Performance measurement systems

Chapter 4 - The Need for Speed

• Market drivers to higher speed interfaces
• Speed vs. density
• The influence of industry standards
• Market trends

Chapter 5 - High Speed Interconnect System Elements

• Driver and receiver technology
• Printed circuit board materials
• Printed circuit board design and fabrication

Chapter 6 - Overview of current high-speed backplane/midplane connectors

• Amphenol TCS - VHDM, VHDM-HSD, GbX,
• Ventura, Aptera, Crossbow
• ERNI Components - ERmet ZD, ERmet zeroXT
• FCI - Metral 4000, AirMax VS
• Hirose - Hx2
• 3M- HSHM
• Molex - VHDM, VHDM-HSD
• Tyco Electronics -HS3, HM Zd, MultiGig RT
• Micro TCA Connectors

Chapter 7 - High-Speed Mezzanine Connectors

• Mezzanine connector architecture
• Advantages of mezzanine packaging
• Interface types/ configurations
• Mezzanine connector applications
• The role of standards

Chapter 8 - Overview of current High-Speed Mezzanine Connectors

• Amphenol TCS - VHDM Stacker, NeXLev
• ERNI - MicroSpeed, Stacking ERmet Zd
• FCI - Meg / Gig Array, Stacking AirMax VS
• Fujitsu - MicroGiGaCN
• HARTING - AMC Connector
• Hirose - IT1, IT-2, IT-4 Series
• Interconnect Systems - HILo
• Molex - Plateau HS Mezz, AMC connector
• Samtec - Rise-Up, Q Pairs, Sam Array
• Tyco Electronics - Mictor, STEP-Z, AMC
• Yamaichi Electronics - AMC

Chapter 9 - High-Speed Backplane Cable Assemblies

• Bringing Cable to the backplane
• Cable assembly characteristics
• Typical applications

Chapter 10 - Overview Of Selected High-Speed Backplane Cable Assembly Suppliers

• WL Gore & Associates
• Meritec
• Molex
• Samtec
• Sanmina SCI
• Tensolite
• Tyco Electronics
• Other suppliers

Chapter 11 - Connector Design Features

• Introduction
• Backplane Connectors
• Amphenol TCS - Aptera L Series
• Amphenol TCS -CrossBow 2mm+
• Amphenol TCS - GbX1
• Amphenol TCS - GbX- L Series
• Amphenol TCS - GbX -E Series
• Amphenol TCS - Ventura
• Amphenol TCS - VHDM - H Series
• ERNI - ERmet Zero XT
• FCI - Metral 40001
• FCI - AirMax VS1
• Hirose - HX-2
• Tyco - Z-Pack HS-3
• Tyco - Z-Pack HM-Zd
• Tyco - Z-Pack Max
• Tyco - MultiGig RT
• 3M - Met Pak HSHM
• Orthogonal Midplane Connectors
• Amphenol TCS - CrossBow Matrix
• Tyco - Z-Pack Max Orthogonal
• Mezzanine Connectors
• Amphenol TCS - VHDM Stacker
• Amphenol TCS - NexLev
• ERNI - MicroSpeed
• FCI - Meg-Array
• FCI - Gig-Array
• Fujitsu - MicroGigaCN
• Hirose - IT-2 Series
• Hirose - IT-4 Series
• Molex - Plateau HS Mezz
• Samtec - Q Series
• Samtec - Sam Array
• Samtec - DP Array
• Samtec - SeaRay
• Tyco - Mictor
• Tyco - 05 FH Shielded Giga
• High Speed Cable Assemblies
• Comparison of physical attributes
• Comparison of electrical performance

Chapter 12 - Market Analysis / Forecasts

• Measurement criteria
• High-Speed backplane / midplane connectors
• World market 2004 -2010 by bandwidth segment
• World market 2004 - 2010 by geographic region
• World market 2004 - 2010 by end user
• High Speed Mezzanine Connectors
• World market 2004 -2010 by bandwidth segment
• World market 2004 -2010 by geographic region
• World market 2004 -2010 by end user
• High Speed Copper Cable Assemblies
• World market 2004 -2010 by bandwidth segment
• World market 2004 -2010 by geographic region
• World market2004 -2010 by end user

Chapter 13 - The Fiber Optic Option

• Fiber optic backplane development status

Chapter 14 - High-Speed connector innovation

• Efficere Technologies
• Particle interconnects
• SiliconPipe contact design
• Foxconn FX-VMP Orthogonal connector

Chapter 15 - Major Findings And Conclusions

Appendix - List Of Contributors