世界の電子部品およびパッケージのリーン・マニュファクチャリング市場

Abstract

Shrinking Dimensions and Increasing Complexity of Electronic Devices Call for Highly Integrated Passive Components

Electronic devices are simultaneously getting smaller and more complex. In keeping with this trend, passive component manufacturers that produce discrete devices need to deliver highly integrated components. The demand is for devices that are efficient, economic, and space-saving. High-end packages, such as ball grid arrays (BGA), multi-chip modules (MCM), staked dies, and chip scale packages (CSP) are widely used for their smaller footprints and high functionality.

This Frost & Sullivan research analyzes the market for electronic components including resistors, capacitors, inductors, and transformers and packages, such as BGAs, CSPs, and MCMs. It also studies evolving technological trends and major challenges faced by the world electronic components and packaging industry and offers strategic recommendations to overcome them and improve market share.

Integrated Passives for Saving Space and Enhancing System Performance

"Passives are evolving from simple gadgets to complex, integrated networks and arrays containing a number of elements which improve system performance," says the analyst. Combinations of these integrated passive devices (IPD) go beyond the basic resistors, capacitors, inductors, and diodes to multiple passive and active components. These IPDs incorporate multiple functions into one module, and find wide use in the automotive industry, cell-phones, USB upstream ports, two-way pagers, Internet devices, and PDAs.

As the electronic industry tries to include more functions into single suites, the thrust is on attaining optimum levels of efficiency with different-value resistors, high-value capacitors, and high-Q inductors. Not all manufacturing technologies are suitable for all electronic modules. The optimal solution would be to offer a combination of technologies, comprising of thin-film, ceramic, and integrated modules. These combinational blocks reduce the size of the device while maintaining specifications and deliver superior performance.

Economic Revival and Growth of Communication Industry in Asia Foretells Growth of Electronic Components Market

With advanced manufacturing processes churning out highly sophisticated equipment in large numbers, there is intense competition. The industry also suffers from lack of investments in new projects and delay in adoption of new products and packages. However, as sales volumes improve with the economy, the impact of these restraints is likely to diminish.

Though the economic downturn signified slowed growth in the communications industry globally, it sees burgeoning growth in India and China where telephone density is low. "The growth of communications including both voice and data transmission is driving revenues of electronic components, such as capacitors, resistors, and inductors and the packaging industry," notes the analyst. Electronic components are also used in communications devices, such as cell phones, fax machines, and other methods of data transfer where the flow of electric current needs to be influenced, further improving revenues.

Table of Contents

• EXECUTIVE SUMMARY
  • Overview
    • Introduction
    • Revenue Forecasts
    • Conclusion
• TOTAL WORLD LEAN MANUFACTURING MARKETS
  • Overview
    • Introduction
    • Total Revenue Forecasts
    • Drivers
    • Restraints
    • Emerging Electronic Component Technologies
    • Emerging Advanced Packaging Technologies
• TOTAL ELECTRONIC COMPONENTS MARKET
  • Total Components Market
    • Market Overview and Definitions
    • Technology Trends for Resistors
    • Technology Trends for Capacitors
    • Technology Trends for Inductors
    • Technology Trends for Transformers
    • End-user Analysis - 1
    • End-user Analysis - 2
    • Strategies for Lean Manufacturing
• TOTAL ELECTRONIC PACKAGES MARKET
  • Total Electronic Packages Market
    • Market Overview and Definitions
    • Technology Trends for Ball Grid Arrays
    • Technology Trends for Chip Scale Packages
    • Technology Trends for Multi Chip Modules
    • End-user Analysis - 1
    • End-user Analysis - 2
    • Strategies for Lean Manufacturing