世界のSoC（System-on-a-Chip）産業

Abstract

This report analyzes the worldwide markets for System-On-A-Chip (SOC) in US$ Million.The specific end-use segments analyzed are Computers, Communication Equipment, Consumer Electronic Devices, Automotive Applications, and Others (Including Industrial Automation, Military, Medical and Other Applications). The major types of SOCs also analyzed are SoCs Based on Standard Cell, and SoCs Based on Embedded IP.The report provides separate comprehensive analytics for the US, Canada, Japan, Europe, Asia-Pacific, and Rest of World. Annual forecasts are provided for each region for the period of 2004 through 2015. The report profiles 189 companies including many key and niche players worldwide such as Actel Corporation, Altera Corporation, ARC International, ARM Holdings, Broadcom Corporation, Core Logic, Freescale Semiconductor, GCT Semiconductor Inc., Infineon Technologies, Intel Corporation, LSI Corporation, Marvell Technology Group Ltd., Matsushita Electric Industrial Co., Ltd, Mentor Graphics Corporation, NEC Electronics Corporation, NVIDIA Corporation, ON Semiconductors Corporation, Palmchip Corporation, Provigent, Inc., Renesas Technology Corp., Samsung Electronics Co., Ltd., STMicroelectronics N.V, Synopsys Inc., Taiwan Semiconductor Manufacturing Co. Ltd., Texas Instruments, Toshiba America Electronics Components, Xilinx, Inc., Zilog Inc., and Ziptronix, Inc. Market data and analytics are derived from primary and secondary research. Company profiles are mostly extracted from URL research and reported select online sources.

Table of Contents

I. INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS

• Study Reliability and Reporting Limitations
• Disclaimers
• Data Interpretation & Reporting Level
• Quantitative Techniques & Analytics
• Product Definitions and Scope of Study

II. EXECUTIVE SUMMARY

1. Market Highlights

2. System-On-A-Chip: A Major Breakthrough in

• Global System-on-a-Chip Market
• SoCs Grow at the Expense of Standalone Chips
• North America Dominates, Asia-Pacific Witnesses Fastest Growth
• Table 1: Global SoCs Market by Geographic Region/ Country: Percentage Share Breakdown for US, Canada, Japan, Europe, Asia-Pacific (Excluding Japan) and Rest of World for 2007 & 2010(includes corresponding Graph/Chart)
• Table 2: Global SoCs Market: Geographic Region/Country Ranked by Growth for US, Canada, Japan, Europe, Asia- Pacific (Excluding Japan), and Rest of World (includes corresponding Graph/Chart)
• SoCs Based on Embedded IP Steals the Limelight
• SoCs Based on Standard Cells Grows with Moderate Rate
• Table 3: Global SoCs Market by Product Type: Percentage Share Breakdown for SoCs Based on Standard Cell, and SoCs Based on Embedded IPs for 2007 & 2010
• Table 4: Global SoCs Market: Product Types Ranked by Growth for SoCs Based on Embedded IP, and SoCs Based on Standard Cell
• Computers and Communications Lead End-use Category
• Table 5: Global SoCs Market by End-use Application: Percentage Share Breakdown for Computers, Communication Equipment, Consumer Electronics Devices, Automotive Applications and Others for 2007 & 2010 (includes corresponding Graph/Chart)
• Table 6: Global SoCs Market: End-Use Applications Ranked by Growth for Consumer Electronics Devices, Automotive Applications, Computers, Communication Equipment and Others (includes corresponding Graph/Chart)
• Consumer Electronics Products on a High Growth Track
• Increasing Usage of SoC Solutions in Medical Field

3. Progression of the SoC Market

4. Factors Driving S-o-C Market

• Increasing Need for Compactness and High Speed
• New End-Use Devices Spark Up SoCs Market
• Innovations Drive Growth
• Growing Demand for 90-nm Technology
• Customization to Meet Client' s Requirements
• Advent of Three-Dimensional Chips
• SoC IP Designs Witness Rising Demand

5. Competitive Overview

• Leading Players in the SoC Market
• Players in Hard Disk Drive SoCs Market - A Recent Past Perspective
• Table 7: Global Hard Disk Drives (HDD) SoCs Market: (2005): Percentage Share Breakdown by Company for Agere, Marvell and STMicroelectronics (includes corresponding Graph/Chart)

6. Industry Challenges

• High Costs, a Major Deterrent
• Time-to-Market Pressures
• Verification Challenges
• Testers - A Solution to the Challenge
• IP Compatibility Issue
• Issues Related to Marketing of ICs
• Customer & Software Support and Staffing Challenges

7. Market Trends & Issues

• Embedded Software to Power System-on-a-Chip (SoC) Solutions
• Advanced ESL Design-For-Verification Solution to Reduce Verification Time for Complex SoCs
• Dual-Core Processors Gain Ground
• ASIC Designs for Supersystems Make a Foray
• Development of IP Market
• Emergence of System-above-Chip (SaC) Market
• Advent of Lab-on-a-Chip (LoC) Technology
• Standardization to Drive the Market
• SoCs Surpasses Standalone Chip in Terms of Price
• Development of Reusable IPs
• Innovations Address Power Leakage and Multiple Tasks Handling
• Consolidation Fuels Growth
• Growth in the Semiconductor Manufacturing Equipment Sector
• Multi-Tasking Microprocessors Gain Significance
• EDA and Silicon Intellectual-Property (IP), Two Burgeoning Sectors
• PLD Market Demand - A Recent Past Perspective
• Table 8: Global Programmable Logic Device (PLD) Market: (2005): Percentage Share Breakdown by Company for Xilinx, Altera and Others (includes corresponding Graph/Chart)
• Customizable Analog IPs Add New Dimension to Complex SoCs
• FPGA Makes Inroads in the Semiconductor Chips Market
• Development of Premanufactured ASICs, and Flash- and SRAM- Series of FPGAs
• Innovative Design Configuration of FPGAs
• Emergence of Three-Tier Design Approach of FPGA-Based Chips
• Evolution of System-On-A-Programmable Chip (SOPC)
• Wide Application of SoCs in Mobile Phones and Broadband Networks
• Standard Logic and Interface Equipment Prevails
• Compact Size of Logic Devices Favors Growth

8. Product Overview

• SoC - Emerging Technology in the Global Semiconductor Industry
• Components of SoC
• System-on-a-Chip (SoC) Block Diagram
• SoC Design Benefits
• "Second-Generation" SoCs
• ASIC SSOC - A New Dimension
• SoC Device Types
• Standard Cells
• Embedded IP
• Micro Logic IP
• Memory IP
• ASIC/PLD IP
• Analog IP & Other Components
• Standards for SoCs
• SoC Processor Types
• Soft Instruction Processors
• Configurable Processors
• Total Design Strategies for SoCs
• Architecture Strategy
• Design-for-Test Strategy
• Validation Strategy
• Synthesis and Back-End Strategy
• Integration Strategy

9. SoC End-Use Applications

• Computers
• Communications Equipment
• Consumer Electronics Devices
• Automotive Applications
• Others
• Industrial Automation & Military
• Medical & Office Devices
• CRM and Hearing Aid Products Dominate the Category
• New Mixed-Signal Radio-Frequency (RF) Technology Design
• SoC-Equipped Nanorobots

10. SoC Intellectual Property (IP)

• Interconnect - A Growing Sector of Semiconductor IP Market

11. System-in-Package (SIP): A Potential Threat

• SiP Market

12. Semiconductor Industry Overview

• Global Semiconductor Industry - Witnessing Rapid Growth
• The Moore' s Law Gives Rise to Sophisticated, Faster and Cheaper Chips
• Technology Advancements Provide Necessary Impetus
• Semiconductor Industry by Geographic Markets
• Asia and the US - Two Major Semiconductors Market
• Leading Semiconductor Players - A Recent Past Perspective
• Table 9: Global Semiconductors Market by Leading Players (2005): Market Share Breakdown by Company for Intel, Samsung, Renesas, Texas Instruments, Toshiba, STMicroelectronics and Others (includes corresponding Graph/Chart)
• Semiconductors Market by End-Use Sectors - A Recent Past Perspective
• Table 10: Global Semiconductors Market (2005): Percentage Share Breakdown by End-Use Sector for EDP, Telecom, Industrial, Automotive, Consumer and Military & Others (includes corresponding Graph/Chart)
• Integrated Circuits and Fabless Market - A Recent Past Perspective
• IC Market
• Table 11: Global Market for IC Design Houses Using Foundry Services (2005): Percentage Share Breakdown by Region for South Korea, Japan, China, Taiwan and Rest of World (includes corresponding Graph/Chart)
• Fabless Market
• Table 12: Global Fabless Market (2005): Percentage Share Breakdown by Region for North America, Asia Pacific, Europe and Rest of World (includes corresponding Graph/Chart)
• Table 13: Global Fabless Market (2005): Percentage Share Breakdown by Company for Qualcomm, Broadcom, NVidia, ATI, SanDisk, Agilent Xilinx, Marvell, MediaTek, Altera and Others (includes corresponding Graph/Chart)
• MEMS Market
• Table 14: Global Micro-Electromechanical Systems (MEMS) Market (2005): Percentage Share Breakdown by Product Type for Actuators and Sensors

13. SoC Technological Developments by

• System-on-a-Chip (SoC) for Printers
• W-OFDM-SoCs
• Xilinx® Virtex™ FPGAs and Embedded Solutions
• EPON-Based System-on-a-Chip (SoC)
• RapidChip® SoC Prototyping Platform
• Analog Devices Othello-E Transceiver
• True System-on-a-Chip (SoC)

14. Product Developments & Launches

• Broadcom Unveils Advanced Encoder/Transcoder SoC Solution
• Broadcom Showcases High Definition Set-Top Box System-on-a-Chip
• Broadcom Unveils a Single Chip DBS Set-Top-Box Solution
• GCT Semiconductor Unveils SoC Solution Supporting WiMAX and WiFi Functionality
• Infineon Releases CAT-iq™ Wireless Engine
• Broadcom Showcases a Whole New Range of SoC Solutions for Mobile Devices
• NVIDIA Introduces an Innovative Applications Processor
• Samsung Introduces Single-Chip Decoder
• Toshiba Introduces SoC Solution for ATSC LCD HDTVs
• Broadcom Uncovers Reference Design Platform for HD Optical Disc Players
• Broadcom Introduces Digital-to-Analog Adapter
• STMicroelectronics Introduces ' ST21NFCA' - SoC Solution for the NFC Market
• Broadcom Unveils SoC Solutions for the Mobile TV Market
• New Series of IC Tuners from Infineon
• TI Integrates Bluetooth®, FM and GPS Technologies on to a Single Chip
• STMicroelectronics Releases Bluetooth® and FM-Radio SoC Solution
• Upgraded Version of 90-Namnometer Reference Flow from SMIC and Synopsys
• Syntax-Brillian Opts Digital TV SoC Solution from Broadcom
• Broadcom Showcases BCM7400B SoC
• Marvell Introduces Bluetooth Single-Chip Solution
• D2 Technologies Unveils Embedded VoIP Software
• Broadcom Rolls Out the New BCM4325 Single-Chip
• Westinghouse Digital Selects BCM3560 SoC Solution
• Broadcom Releases the BCM7118 Single Chip
• Infineon Launches 3G ADSL2+ SoC
• ARC International Launches New VRaptor™ Media Architecture
• MOSAID Rolls Out Memorize™ and Fractional-N PLL
• Starport Systems Unleashes SoC Solution for Gen2 UHF RFID Readers
• Alvand Technologies Unveils SoC Humming-B™ Family of Tuners
• MagnaChip Releases MC531EA SoC Imaging Solution
• Genesis Microchip Unveils the Chaplin DTV family of ICs
• PMC-Sierra Unveils the PAS65311 GPON ONT Reference Design Solution
• STMicroelectronics Unleashes the SPEAr Head600 and SPEAr Plus600 ICs
• CAST, Inc. Rolls Out the SOC Kernels
• ARM and Northwest Logic' s PCI-SIG-compliant solution
• Cypress Releases The PSoC Express 2.1
• Texas Instruments Unveils Single-Chip NaviLink™ 5.0 Solution
• Sonics Launches New Version of SonicsMX® SMART Interconnect™ Solution
• SanDisk to Roll Out 8-Gb & 16Gb MLC NAND Flash Memory Chip
• Broadcom Launches BCM7440 Blu-ray/HD DVD SoC Solution
• Freescale Launches PowerQUICC™ III Processor Line
• Freescale Introduces Multicore MPC8572 Family
• Freescale Unveils the MPC8323E Processor
• GCT Semiconductor Releases Monlothic Single Chip
• National Semiconductor and ARM Launch PWI 2.0 Specification
• NEC Electronics Rolls Out UX7LSeD Technology
• NEC Electronics Launches MP201 Single-Chip Application Processor
• NEC Electronics Introduces 55nm Standard CMOS Process Technology
• National Semiconductor LM5071 Single Chip Solution
• Synopsys Unveils DesignWare® Mobile Storage
• Denali' s Databahn™ Product Released for NAND Flash Memory Devices
• Pixelplus Unleashes PM1001 and PO4030 SoC Solutions
• Adventiq' s Launches KVM System-On-A-Chip Product
• Semtech Corporation Rolls Out SX8801R SoC for Data Acquisition
• Key ASIC Unleashes the KeySoC™ Platform
• Summit Unleashes the Panorama™ in Three Configurations
• Micronas Unveils a New Audio SoC Solution for TV - Manufacturers
• LTRIM Technologies Launches Latest Genre of DC-DC Converter IP Blocks
• Silistix' s New Chip Area Interconnection (CHAIN) Scheme
• SigmaTel Unleashes the STDC3000 SoC Controller Solution
• Chipcon Releases the ' CC1110' SoC Solution for Wireless Payment Systems
• Atmel® Corporation Launches its All-Format DVD SoC
• Pixelplus Releases the 1.3 Megapixel Image Sensor PO5130 SoC
• Broadcom Introduces SoC Power Management Unit
• FMA Launches the Mobile WiMAX System-on- Chip (SoC) Solution
• DSP Group Unveils A New System-on-a-Chip Solution
• IP Cores Introduces Two Advanced Encryption Standard (AES) Based Security IP Cores
• PMC-Sierra Unveils Multi-Service MIPS-based Processor SoC Solution
• Conexant Releases ADSL2plus Central Office SoC Solution
• TI Releases VoIP System-on-a-Chip Solution
• Zoran Unveils System-on-Chip Approach 5 family of Processors
• DAFCA Releases ClearBlue™ version 2006.1 Product Suite
• TEK Microsystems and QinetiQ RTES Jointly Develop the JazzStore SoC™
• LG to Design SoCs by Employing Apache' s RedHawk-EV Solution
• Faraday Unveiled the FIE7010- an MP3 Player SoC Platform
• Pixelplus Releases Second Generation of SoC Image Sensors
• PMC-Sierra Launches the PM5336 ARROW 2488
• Provigent Introduces Development Kit for Wireless PTP Systems
• Renesas Unveils Transistor Technology Using Hybrid CMIS Transistors
• Renesas Unleashes the "SH7774" SoC Solution for Car Navigation Devices
• Renesas Introduces Chip-on-Chip Technology
• S2C Releases Two Models of Rapid FPGA Prototyping Solution Series
• Samsung Electronics Unveils System-on-Chip Solution for Hybrid Drive
• STMicroelectronics Introduces the T90 System-on- Chip (SoC) Solution
• Synopsys Develops PCI Express to AMBA 2.0 AHB DesignWare® Bridge
• Toshiba Introduces Second Generation of TC904XX Family of SoCs
• Toshiba Unveils 2.0 Megapixel and 3.2 Megapixel CMOS SoC Image Sensors
• Hua Hong NEC and Synopsys Unveil their Reference Design Flow 2.0
• Sonics Inc., Unveils SonicsMX SMART Interconnects Solution
• Sonics White Paper Defining SoC Interconnect Options for Developers
• Sonics Introduces the SonicsLX SMART Interconnect Solution
• Actel Introduces Design Infrastructure for ARM7-Enabled Fusion Programmable System Chips
• Actel Unveils the CoreMP7 Development Kit for ARM7-Enabled CoreMP7 Soft Processor Core
• Cypress Semiconductor Launches New Evaluation Kit for Wireless Radio System-on-a-Chip (SoC)
• Pentax Introduces Optio A10 Image Stabilization System Using Cypress' PsoC
• Hynix and M-Systems Introduces DOC Embedded Flash Drive (EFD)
• Sonics Unveils a New S3220 SMART Interconnects Solution
• Atmel Unveils New SoC Solution
• Agere Systems Develops USB 2.0 SoC
• Sunplus Unveils SPG290, a High-Performance System-on-a-Chip (SoC)
• Renesas Introduces Two Single-Chip ICs
• Renesas Unveils SH7397 32-Bit Microprocessor as a Single Chip Solution
• STMicroelectronics Releases 90nm HDD SoC devices
• Zoran Launches APPROACH 5, SoC for Mobile Handsets
• SigmaTel Unveils New SoC Solution for Multi-Function Printers
• CEVA Introduces a New DSP Architecture, the CEVA-X1621™
• Conexant Systems Unveils Integrated Xenon SoC Solution
• K-Micro Releases Topaz Computing Subsystem for SoCs
• Samsung Electronics Introduces 90-nm SoCs for Mobile Applications
• Magma and ARM Unveils an Advanced Implementation Solution for SoC Designs
• Parama Networks Unveils Transport SoC Technology
• Renesas Develops Advanced TTRAM for High-Speed and Low Power Consuming Applications
• Renesas Introduces Automated Device Sizing System for Use in SoCs
• S2C Releases New Interconnect Technology for SoC Designs
• PortalPlayer Introduces Two New Audio SoCs
• LSI Logic Corporation Innovates RapidChip SoC Prototyping Platform
• PRO/Wireless 5116 SoC from Intel
• New SoC Solution from Micronas
• Chipcon Innovates CC2431 ZigBee™ SoC Solution
• Ziptronix Develops Three-Dimensional System-on-a-Chip Device
• 1st Silicon and ZFOUNDRY Develops A18 Technology
• Chipcon Unveils CC2430 ZigBee SoC Solution
• Cypress Unveils 1.3-Megapixel SoC and Image Sensor Solutions
• Marvell Unveils VoWLAN SoC Solutions
• Micron Technology Unveils New SoC Sensor
• Mindspeed Technologies Introduces SoC Solution
• BroadLight Unveils BL2000 SoC
• STMicroelectronics Innovates SoC IC Devices
• RF Micro Devices Releases SiW4000 Bluetooth SoC Solution
• Vitesse Unveils Ethernet Switch System-on-a-Chip Solutions
• Cypress Develops Programmable System-on-a-Chip, CY8C24794-24LFXI
• Cypress Launches Programmable SoC, CY8C21x23
• FS2 System Navigator from First Silicon Solutions
• AMI Semiconductor Enhances its SmartPower SoC Mixed-Signal IC Technology
• AMI Semiconductor Develops Miniature Single-Chip Stepper Motor Driver-Controller ICs
• Atheros Develops Integrated Single-Chip 802.11g Access Point Solution
• Matsushita (Panasonic) Develops HD-PLC Technology for Home Networking Applications
• AXIOM Introduces MPSim™ System Verilog Verification
• Provigent Launches PVG310 Single-Chip Modem
• QUALCOMM and TSMC Jointly Develops 90-nm MSM™ Solutions
• Renesas Offers Embedded DRAM Core for SoCs
• RF Micro Unveils SiW4000™ SoC Bluetooth® Solution
• Samsung Develops ViP Design Methodology for Significantly Reducing SoC Design Time
• QuickLogic Corporation Introduces New Programmable SoC Devices
• New Solution for ESL Designs
• Vitesse Develops Gigabit Ethernet Switches
• Passave Develops SoC for EPON
• Enpirion Unveils Power SoC Solution
• CEVA Unveils Xpert-Palm
• Agilent Offers SoC Solution for PDAs
• Advantest Develops New T2000 MS Mainframe for Mid-Range SoC Devices
• Advantest Introduces T6577 SoC Test System

15. Recent Industry Activity

• ON Semiconductor Acquires AMI Semiconductor
• Broadcom Takes Over Sunext Design
• Broadcom Collaborates with Microsoft
• Broadcom Along with Coship Provides HD Set-Top Box Solution in China
• Zilog Signs Distribution Agreement with Nu Horizons
• BroadLight partners with ITRI
• ARC Extends Collaboration Agreement with Toshiba
• Samsung Uses Integrated FM Radio and Bluetooth® SoC from Broadcom
• NEC Opts Wipro to Provide Semiconductor Design Solutions
• Axiom Invests US$3 Million for New R&D Center in India
• Matsushita Implements IC Compiler of Synopsys
• EtherWaves Acquires Sonarics
• Silicon Image Acquires sci-worx
• Cortina Systems Acquires ImmenStar
• Wipro Acquires OTCS
• Synopsys Acquires MOSAID IP Assets
• BroadLight Collaborates with OpenCon Systems
• Mindspeed Partners with Terawave
• IC Nexus Partners with HDL Design House
• Global Unichip Allies with Vivante Graphics
• Jazz and Fujitsu Join Forces
• Coronis Systems Partners with Essensium N.V.
• Global Unichip Opts Testing Solution from Synopsys
• Core Logic to Establish Solution Center in China
• Newark Signs Franchise Agreement with Cypress
• Silicon Image Signs an Accord with Sunplus
• ARC Signs Multiple Agreements
• Global IP Sound Changes to Global IP Solutions
• Faraday Forms an Alliance with Palmchip Corporation
• CAST Enters into a Distribution Agreement with S2C
• Renesas - ZMD Alliance to Introduce 900-MHz Band ZigBee® Chipset by 2008
• Renesas Enters into an Agreement with Key Stream Corporation
• Renesas and Matsushita into their Fifth Stage of Collaboration
• Renesas Employs Synopsys' VCS Verification Solution and VMM Methodology
• Renesas Adopts Synopsys' IC Compiler Solution
• S2C Inc. is Tensilica® Inc.' s New Prototyping Partner in China
• Sonics Inc.® Enters into an Agreement with Ricoh Company
• MoSys Adopts SMIC' s CMOS Process Technology
• e2v Opts Tower Semiconductor to Manufacture CMOS Image Sensors
• Haier Group Adopts Broadcom' s Digital TV System-on-Chip Solution
• AMI Semiconductor Acquires Assets of NanoAmp
• AMD Acquires ATI Technologies
• LSI Buys Metta Technology
• NVIDIA Acquires PortalPlayer
• PMC-Sierra Acquires Passave
• Broadcom Purchases Sandburst
• Texas Instruments Purchases Chipcon AS
• Essensium Acquires Mind
• inSilicon and Sonics Form an Alliance for Developing Plug-and-Play SoC Platforms
• Sonics and CoWare® Enter into a Distribution Agreement
• BroadLight Enters into a Contract with Askey Computer
• Actions Semiconductor and GMI Sign an Agreement
• Mistletoe and eSilicon Develop an Integrated VPN-firewall SoC
• Matsushita Collaborates with Renesas to Test 45-nm SoC Technology
• Imagination Starts Operations in the US
• Air Broadband Selects FMA' s WiMAX SoC Solution
• ARM Licenses Advantage and Metro Products for 45 nm Technology
• QUALCOMM Starts Production of 90nm Chips
• eASIC Adds Two European Firms to Support Nextreme Line
• Newport Grabs More Funds to Develop SoC Solutions
• Sonics Inks an Agreement with CoWare
• SMIC and ARC Sign A Joint Agreement
• Toshiba Signs an Agreement with ARM
• ARCA Licenses ARM926EJ-STM Processor
• CMP Licenses ARM® RealView® ESL Tools
• Freescale to License The V2 ColdFire Core
• GCT Gets License for ARM926EJ-S™ Processor
• MIPS and msystems Unite to Develop a Safe-SOC™ Security platform
• Mobileye Obtains License for MIPS32® 34Kf™ Core
• Extreme DA Collaborates with UMC
• Scaleo chip Signs an Agreement with Wipro-NewLogic
• Key ASIC Partners with Silterra Malaysia Sdn. Bhd.
• STMicroelectronics Partners with iBiquity Digital Corporation
• SOCLE Employs UMC' s 90nm Process Technology
• Wipro Technologies Partners with Tensilica' s Processor Core Design Center
• Global Locate Partners with Toshiba to Roll Out Marlin™ A-GPS Chip
• Renesas Design Vietnam Opts Synopsys as EDA Provider
• CoWare Enters into a Strategic Agreement with Sonics
• CoFluent Collaborates with Sonics Inc.
• Summit Sells SystemC-based Sonics SMART Interconnects Solutions
• Bay Microsystems Acquires Parama Networks
• Broadcom Acquires Athena Semiconductors
• Cadence Acquires Verisity
• MOSAID Takes Over Virtual Silicon
• NVIDIA and ARM Enters into a Licensing Agreement
• SkyPilot Enters into a Contract Agreement with Fujitsu Microelectronics for WiMAX SoCs
• Virage Logic Enters into an Agreement with UMC
• ZAiQ Technologies Teams Up with S2C Inc.
• Synopsys Joins Forces with UMC
• Marvell Enters into a Deal with UTStarcom
• Tensilica Signs an Agreement with EVE
• Global UniChip Signs an Agreement with Synopsys
• Tower Semiconductor and Cadence Joins Forces
• Silterra Teams Up with Essensium
• White Electronic Designs Secures Contract for Supply of SoC Microprocessor Modules
• BroadLight Enters into a Licensing Agreement with MIPS Technologies for MIPS® Processor
• ARM Acquires Artisan Components
• Flextronics Partners with inSilica for the Development of SoC Solutions
• ARM, Artisan Components, NSC, Synopsys and UMC Collaborate for Advanced SoC Technology
• Ansoft Corporation Joins forces with Synopsys, Inc
• Nordic Semiconductor Obtains New Components Contract in Europe

16. Related Product/Corporate Developments

• Imagination Technologies Unveils New HD Video Decoder Core
• Mobileye Selects SMART Interconnect Solution of Sonics
• Cypress Semiconductor Introduces CY3630 Evaluation Kit for its Wireless Radio SoCs
• Renesas Technology Unveils Twin-Transistor RAM
• New Products from Texas Instruments
• K-Micro Develops Topaz Computing Subsystem
• New Innovations from AMI Semiconductor
• MemMax Memory Scheduler from Sonics, Inc
• Sonics Inc. Unveils New Version of SonicsMX SMART Interconnect
• SkyPilot Networks Selects SoC Solutions of Fujitsu Microelectronics
• Agere Systems Deploys IC Compiler of Synopsys
• Aperto Employs SoC Solutions of Fujitsu
• Jazz Semiconductor Unveils Innovative Process Platform for Advanced RF and Analog SoCs
• Telairity Launches Unique Processor Architecture for High Definition Video
• CoWare and Cadence Develop ESL Design Verification Flow
• Advantest Unveils Mid-Range SoC Test Solution
• Mentor Graphics Introduces Platform Express Product for SPIRIT 1.0 Norms

17. Focus on Select Players

• Actel Corporation (US)
• Altera Corporation (US)
• ARC International (US)
• ARM Holdings (UK)
• Broadcom Corporation (US)
• Core Logic (South Korea)
• Freescale Semiconductor (US)
• GCT Semiconductor Inc. (US)
• Infineon Technologies (Germany)
• Intel Corporation (US)
• LSI Corporation (US)
• Marvell Technology Group Ltd. (US)
• Matsushita Electric Industrial Co., Ltd (Panasonic) (Japan)
• Mentor Graphics Corporation (US)
• NEC Electronics Corporation (Japan)
• NVIDIA Corporation (US)
• ON Semiconductors Corporation (US)
• Palmchip Corporation (US)
• Provigent Inc. (US)
• Renesas Technology Corp. (Japan)
• Samsung Electronics Co., Ltd. (South Korea)
• STMicroelectronics N.V. (Switzerland)
• Synopsys Inc. (US)
• Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
• Texas Instruments (US)
• Toshiba America Electronics Components (US)
• Xilinx Inc. (US)
• Zilog Inc. (US)
• Ziptronix, Inc. (US)

18. Global Market Perspective

• Table 15: World Recent Past, Current & Future Analysis for System-on-a-Chip (SoC) by Geographic Region/Country - US, Canada, Japan, Europe, Asia-Pacific (Excluding Japan) and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2004 through 2010 (includes corresponding Graph/Chart)
• Table 16: World Long-term Projections for System-on-a-Chip (SoC) by Geographic Region/Country - US, Canada, Japan, Europe, Asia-Pacific (Excluding Japan) and Rest of World Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2011 through 2015 (includes corresponding Graph/Chart)
• Table 17: World 10-Year Perspective for System-on-a-Chip (SoC) by Geographic Region/Country - Percentage Breakdown of Dollar Sales for US, Canada, Japan, Europe, Asia-Pacific (Excluding Japan) and Rest of World Markets for 2004, 2008 and 2013 (includes corresponding Graph/Chart)
• Table 18: World Recent Past, Current & Future Analysis for System-on-a-Chip (SoC) by Product Type - SoCs Based on Standard Cell and SoCs Based on Embedded IP Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2004 through 2010 (includes corresponding Graph/Chart)
• Table 19: World Long-term Projections for System-on-a-Chip (SoC) by Product Type - SoCs Based on Standard Cell and SoCs Based on Embedded IP Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2011 through 2015(includes corresponding Graph/Chart)
• Table 20: World 10-Year Perspective for System-on-a-Chip (SoC) by Product Type - Percentage Breakdown of Dollar Sales for SoCs Based on Standard Cell and SoCs Based on Embedded IP Markets for 2004, 2008 and 2013
• Table 21: World Recent Past, Current & Future Analysis for System-on-a-Chip (SoC) by End-Use Application - Computers, Communications Equipment, Consumer Electronics Devices, Automotive Applications and Other Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2004 through 2010 (includes corresponding Graph/Chart)
• Table 22: World Long-term Projections for System-on-a-Chip (SoC) by End-Use Application - Computers, Communications Equipment, Consumer Electronics Devices, Automotive Applications and Other Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2011 through 2015 (includes corresponding Graph/Chart)
• Table 23: World 10-Year Perspective for System-on-a-Chip (SoC) by End-Use Application - Percentage Breakdown of Dollar Sales for Computers, Communications Equipment, Consumer Electronics Devices, Automotive Applications and Other Markets for 2004, 2008 and 2013 (includes corresponding Graph/Chart)

III. MARKET

1. North America

• Semiconductors Market Perspective
• An Overview of the SoC Market

1a. The United States

• A. Market Analysis
  • Rise in SoC End-Use Sectors Drives the Growth
  • Technological Innovations Adds to Growth
  • The U.S. Companies Follows Outsourcing Strategy to Reduce Costs
  • Product Developments & Launches
  • Strategic Corporate Developments
  • Related Product/Corporate Developments
  • Focus on Select Players
  • Actel Corporation
  • Altera Corporation
  • ARC International
  • ARM-US
  • Atmel Corporation
  • AXIOM Design Automation
  • Broadcom Corporation
  • Sandburst Corporation
  • BroadLight, Inc.
  • Cadence
  • Conexant Systems, Inc
  • CPU Technology, Inc
  • Cypress Semiconductor Corp
  • Enpirion
  • Eureka Technology
  • Freescale Semiconductor
  • Fujitsu Microelectronics
  • GCT Semiconductor Inc.
  • IBM Microelectronics
  • Intel
  • LSI Corporation
  • Marvell Technology Group Ltd.
  • Magma Design Automation
  • Mentor Graphics Corporation
  • Mindspeed Technologies
  • MIPS Technologies
  • Motorola
  • National Semiconductor
  • NEC Electronics America
  • NeoMagic Corporation
  • NVIDIA Corporation
  • ON Semiconductors Corporation
  • Palmchip Corporation
  • Palmchip Semiconductor
  • Bay Microsystems
  • PMC-Sierra
  • Provigent Inc.
  • QuickLogic Corporation
  • RF Micro Devices
  • S2C Inc.
  • SanDisk Corp.
  • Sonics, Inc
  • Synopsys Inc.
  • Texas Instruments Incorporated
  • Toshiba America Electronics Components
  • Wipro Technologies
  • Xilinx Inc.
  • Zilog Inc.
  • Ziptronix, Inc.
• B. Market Analytics
  • Table 24: The US Recent Past, Current & Future Analysis for System- on-a-Chip (SoC) Market Independently Analyzed with Annual Sales Figures in US$ Million for Years 2004 through 2010 (includes corresponding Graph/Chart)
  • Table 25: US Long-term Projections for System-on-a-Chip (SoC) Market Independently Analyzed with Annual Sales Figures in US$ Million for Years 2011 through 2015 (includes corresponding Graph/Chart)

1b. Canada

• A. Market Analysis
  • Mosaid Technologies, Inc. - A Major Player
• B. Market Analytics
  • Table 26: The Canadian Recent Past, Current & Future Analysis for System-on-a-Chip (SoC) Market Independently Analyzed with Annual Sales Figures in US$ Million for Years 2004 through 2010 (includes corresponding Graph/Chart)
  • Table 27: Canadian Long-term Projections for System-on-a- Chip (SoC) Market Independently Analyzed with Annual Sales Figures in US$ Million for Years 2011 through 2015(includes corresponding Graph/Chart)

2. Japan

• A. Market Analysis
  • An Overview of Japanese Semiconductor Market
  • Consumer Profile
  • Foreign Players Ties-Up with Local Fabricators and Vendors
  • Local Companies Expands Customer Base
  • SoC Market Overview
  • Growth in IC Sector
  • Product Developments & Launches
  • Strategic Corporate Developments
  • Related Product/Corporate Developments
  • Focus on Select Players
  • Hitachi, Ltd.
  • Matsushita Electric Industrial Co., Ltd (Panasonic)
  • NEC Electronics Corporation
  • Renesas Technology Corp.
• B. Market Analytics
  • Table 28: Japanese Recent Past, Current & Future Analysis for System-on-a-Chip (SoC) Market Independently Analyzed with Annual Sales Figures in US$ Million for Years 2004 through 2010 (includes corresponding Graph/Chart)
  • Table 29: Japanese Long-term Projections for System-on-a-Chip (SoC) Market Independently Analyzed with Annual Sales Figures in US$ Million for Years 2011 through 2015 (includes corresponding Graph/Chart)

3. Europe

• A. Market Analysis
  • Semiconductors Market Overview
  • SoC Market Overview
  • Semiconductors Market by European Regions - A Recent Past Perspective
  • Table 30: Semiconductors Market in Europe (2005 & 2006): Percentage Share Breakdown by Region/ Country for Germany, UK, France, Nordic Countries, Italy, Benelux Region and Rest of Europe (includes corresponding Graph/Chart)
  • Semiconductors Market by End-Use Sectors - A Recent Past Perspective
  • Table 31: Semiconductors Market in Europe (2005): Percentage Share Breakdown by End-Use Sector for EDP, Telecom, Automotive, Consumer, Industrial and Military & Others (includes corresponding Graph/Chart)
  • Consolidation Drives the Market
  • Market Trends
  • SoC Deployment Rises for the Automotive and the Communications Sector
  • Demand for Pre-Configured Functional IP Blocks Rising
  • Subcontracting Increases for Final SoC Products Assembly to Low- Cost European Countries
  • Product Developments & Launches
  • Strategic Corporate Developments
  • Related Product/Corporate Development
  • Focus on Select Players
  • ARM Holdings (UK)
  • Essensium (Belgium)
  • Infineon Technologies (Germany)
  • NEC Electronics (Europe) (Germany)
  • Nordic Semiconductor (Norway)
  • OKI Electric Europe (Germany)
  • Samsung Electronics (UK)
  • STMicroelectronics N.V. (Switzerland)
• B. Market Analytics
  • Table 32: European Recent Past, Current & Future Analysis for System-on-a-Chip (SoC) Market Independently Analyzed with Annual Sales Figures in US$ Million for Years 2004 through 2010 (includes corresponding Graph/Chart)
  • Table 33: European Long-term Projections for System-on- a-Chip (SoC) Market Independently Analyzed with Annual Sales Figures in US$ Million for Years 2011 through 2015 (includes corresponding Graph/Chart)

4. Asia-Pacific

• A. Market Analysis
  • SoC Market Overview
  • Asia Emerges as a Major Market for SoC Deployment in Wireless Devices
  • China
  • India
  • From Just Design to Complete Solutions
  • Challenges Faced
  • South Korea
  • Integrated Circuits (ICs) Market - A Recent Past Perspective
  • Table 34: Integrated Circuits (ICs) Market in Korea (2005): Percentage Share Breakdown by End-Use Services for Corporate Management, Design & Development, Engineering Management, Test Engineering and Others (includes corresponding Graph/Chart)
  • Korean SoC Market on a Rise
  • Product Developments & Launches
  • Strategic Corporate Developments
  • Focus on Select Players
  • X-FAB Sarawak Sdn. Bhd. (Malaysia)
  • 5V Technologies (Taiwan)
  • Core Logic (South Korea)
  • Dongbu HiTek Company Ltd. (South Korea)
  • EE Solutions (Taiwan)
  • Faraday Technology Corp. (Taiwan)
  • Global Unichip Corp. (Taiwan)
  • Hynix Semiconductor (South Korea)
  • ICNexus (Taiwan)
  • Insilica Semiconductors (India)
  • Integrated Circuit Solution (Taiwan)
  • Samsung Electronics Co., Ltd. (South Korea)
  • Silicon Motion Technology (Taiwan)
  • Silterra Malaysia Sdn. Bhd. (Malaysia)
  • Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
  • United Microelectronics Corp. (Taiwan)
• B. Market Analytics
  • Table 35: Asia-Pacific Recent Past, Current & Future Analysis for System-on-a-Chip (SoC) Market Independently Analyzed with Annual Sales Figures in US$ Million for Years 2004 through 2010 (includes corresponding Graph/Chart)
  • Table 36: Asia-Pacific Long-term Projections for System- on-a-Chip (SoC) Market Independently Analyzed with Annual Sales Figures in US$ Million for Years 2011 through 2015 (includes corresponding Graph/Chart)

5. Rest of World

• Market Analysis
• Table 37: Rest of World Recent Past, Current & Future Analysis for System-on-a-Chip (SoC) Market Independently Analyzed with Annual Sales Figures in US$ Million for Years 2004 through 2010 (includes corresponding Graph/Chart)
• Table 38: Rest of World Long-term Projections for System- on-a-Chip (SoC) Market Independently Analyzed with Annual Sales Figures in US$ Million for Years 2011 through 2015 (includes corresponding Graph/Chart)

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