Abstract
Modular, multichamber, integrated process systems -- cluster tools -- have
achieved worldwide recognition, and have become widely accepted worldwide as a
key concept for VLSI manufacturing.
The rationale behind the cluster concept is to:
- Reduce cycle times
- Reduce wafer handling by operators
- Reduced particulate contamination
- Reduced molecular contamination
- Ability to initiate difficult processes
The perceived advantages of cluster tools comes at a time when the
semiconductor industry has been is a sustained growth period, when rising
costs has increased the cost of a 35,000 sq. ft. fab to $3 billion.
However, despite the claims for the advantages of cluster tools, quantitative
data have been largely unproven. Open architectures, which will open the flood
gates for standardization in the equipment industry, have not been established
sufficiently to prove their value. As a result, closed architecture systems
will continue to be sold throughout the timeframe of this study, even though
they may not necessarily provide the lowest cost or best technology for a
specific process. The attainment of a high reliability factor has prevented
any successful implementation of automation in an IC facility. The advent of
powerful, inexpensive microcomputers with high-speed data acquisition and
processing capabilities has enabled manufacturers to build equipment with
sufficient intelligence to monitor a variety of parameters. Advances in the
field of remote sensing and control components has also enabled these
functions to be measured with greater accuracy. A host or mode computer can
provide better wafer process control and tracking as well as accurate
diagnostic information should a problem occur.
Future cluster tools will implement much more sophisticated monitoring to
assure process functionality and provide a means of detecting and correcting
problems. To assure proper process completion and sequence, diagnostic tools
are being incorporated inside process modules for real-time communication
feedback. These tools will require highly developed internal system diagnostic
capability; highly integrated equipment will require intensive sensing
technology.
This report addresses these technical issues, presenting an analysis of the
industry, the key players, and the driving forces directing the cluster tool
concept. Markets are analyzed and are segmented by flexible and non-flexible
cluster tools.
Table of Contents
Chapter 1 Introduction
Chapter 2 Executive Summary
- 2.1 Summary of Technical Issues
- 2.2 Summary of Market Forecast
Chapter 3 Interface Standards
- 3.1 SEMI/MESC
- 3.3 High-Speed Secs Message Services (HSMS) Standard
- 3.4 GEM
- 3.5 Standards Directions
Chapter 4 The Cluster Concept
- 4.1 Definitions
- 4.2 Device Technology and Integrated Processing
- 4.3 Main Functional Units
- 4.3.1 Central Handling Platform
- 4.3.2 Cassette Stations
- 4.3.3 Extension Modules
- 4.3.4 Single Process Modules
- 4.3.5 Batch Modules
- 4.3.6 Multiple Process Modules
- 4.4 Cluster Tool Communications
- 4.4.1 Cluster Tool Controller
- 4.4.2 Transport Module Controller
- 4.4.3 Process Module Controller
- 4.4.4 Control Software
- 4.4.5 Human Interface Software
- 4.4.6 Networking Software
- 4.5 Vacuum System Design
Chapter 5 Commercial Cluster Tools
- 5.1 Cluster Tools and Suppliers
- AIO
- Alcatel
- Anelva
- Apex
- Applied Materials
- ASM
- ASML
- Aviza Technology
- BLE Laboratory Equipment
- Brooks Automation
- Convac-APT
- Couger Labs
- DaiNippon Screen
- Ebara
- FSI International
- Genmark
- Genus
- Ginitech
- Hitachi
- IPS
- Jipelec
- Jusung Engineering
- Kanematsu Semiconductor
- Kokusai
- Kornic
- Lam Research
- Mattson Technology
- Modern Industries
- Modular Process Technology
- Novellus Systems
- Oxford Instruments Plasma Technology
- Primaxx
- Rorze
- Samsung Electronics
- SC Fluids
- Semitool
- Sentech
- Surface Technology Systems
- Suss MicroTec AG
- Tegal
- Tek-Vac
- Thermo Electron Corp.
- Tokyo Electron
- Trikon Technologies
- Ulvac
- Unaxis
- Vactronics Lab Equipment
- Veeco
- 5.2 Process Modules and Suppliers
- AXIC
- Nanaometrics
- Nicolet
- Nova Measuring Instruments
- Pfeiffer Vacuum
- XMR
Chapter 6 Cluster Tool Process Trends
- 6.1 Introduction
- 6.2 Deposition - Plasma Etch
- 6.3 Deposition - Rapid Thermal Processing
- 6.4 Lithography - Resist Processing
- 6.5 Diagnostics - Process
- 6.6 CMP Polish - Clean
Chapter 7 Cluster Tool Issues
- 7.1 Introduction
- 7.2 Equipment Reliability
- 7.3 Equipment Maintainability
- 7.4 Challenges
- 7.5 Opportunities
Chapter 8 Economic and Human Resource Issues
- 8.1 Introduction
- 8.2 Economic Justification
- 8.2.1 Background
- 8.2.2 Cost Justification
- 8.2.3 Reserves
- 8.2.4 Personnel Costs
- 8.2.5 Other ROI Considerations
- 8.3 Human Resources Impact
- 8.3.1 Background
- 8.3.2 Direct Labor
- 8.3.3 Equipment Support
- 8.3.4 Process Engineering
- 8.3.5 Operations Staff
Chapter 9 Market Forecast
- 9.1 Introduction
- 9.2 Market Forecast Assumptions
- 9.3 Market Forecast
- 9.3.1 Total Available Equipment Market
- 9.3.2 Flexible Cluster Tool Market
- 9.3.3 Non-Flexible Cluster Tool Market
- 9.3.4 Total Cluster Tool Market
FIGURES
- 3.1 Trend in Use of SECS by Equipment Manufacturers
- 4.1 Basic Cluster Tool Architecture
- 4.2 Basic Cluster Tool Architecture
- 4.3 Communication Architecture in a Cluster Tool
- 5.1 Anelva's Cu CVD Process Tool
- 5.2 Process Chambers in Applied Materials'
- EPI Centura System
- 5.3 Brooks Automation's Gemini Express 8000
- 5.4 Process Chambers in Hitachi's M600 Etcher
- 8.1 Segmentation of Operator Processing Functions
- 9.1 Shares of the Total Available Market
- 9.2 Market Forecast of Flexible Cluster Tools
- 9.3 Market Shares of Flexible Cluster Tools
- 9.4 Market Forecast of Non-Flexible Cluster Tools
- 9.5 Market Shares of Non-Flexible Cluster Tools
- 9.6 Cluster Tools vs Total Available Market
- 9.7 Cluster Tools vs Total Available Market
- 9.8 Cluster Tools as % of TAM
TABLES
- 3.1 Corporate Participants in SEMI/MESC
- 4.1 Model for DRAM Production Line
- 9.1 Total Available Equipment Market Forecast
- 9.2 Total Cluster Tool Equipment Market Forecast
電子部品/半導体
その他のカテゴリ
FAQ