中国のICパッケージング・試験産業

Abstract

In 2006, China' s semiconductor packaging and testing industry shipment value reached 51.2 billion RMB (US$6.8 billion; US$1 = 7.5 RMB). Although this was a 48.4% increase compared to 2005, IC packaging and testing only held a 50.8% share of China' s IC industry compared to 74.3% in 2002. In 2007, while NXP, Qimonda, Micron Semiconductor, Kingston Technology, and Samsung have invested in China to construct new production lines or expand capacity, TI was choosing between China and the Philippines and was likely to partner with the Philippines government in the end. Chinese IC packaging and testing service providers have been establishing strategic alliances to improve their technologies and create new business opportunities. This report will analyze the current status of the IC packaging and testing industry in China as well as leading companies' opportunities and challenges.

Table of Contents

Current status of the Chinese semiconductor packaging and testing industry, including revenue during the period 2002 -2006 and leading players; development of major semiconductor companies in China, including Freescale Tianjin Final Manufacturing, Qimonda Technology, RFMD (Beijing), Shenzhen STS Micro-Electronics, Shanghai Matsushita Semiconductor, Intel Products (Shanghai), Nantong Fujitsu Microelectronics, and Changjiang Electronics; future trends for the Chinese semiconductor packaging and testing industry.

• Development of Semiconductor Packaging and Testing in China
• Freescale Semiconductor' s Development
• Qimonda Technology' s Development
• RFMD Beijing' s Development
• Shenzhen STS Micro-Electronics' Development
• Shanghai Matsushita Semiconductor' s Development
• Intel Product' s Development
• Nantong Fujitsu Microelectronics' Development
• Changjiang Electronics' Development
• STATS ChipPAC' s Development
• MIC Perspective
• Appendix

ANST, ASE (Shanghai), Changjiang Electronics, China Resources Microelectronics (Holdings), Freescale Semiconductor, Fujitsu Limited Japan, General Semiconductor (China), Giemin Electronics, Hangzhou Youwang Electronics, Hitachi Semiconductor (Suzhou), Hua Yue Microelectronics, HuaXu Microelectronics, Huayue IC Packaging, Hynix-ST Semiconductor, Hyundai Electronics (Shanghai), IBM, Infineon, Intel, Intel Products (Shanghai), Intel Technology Development (SH), International Rectifier, Jiangsu Syber Electronic, Jiangyin Changdian Advanced Packaging, Kingston Technology, Leshan Phoenix Semiconductor, Leshan Radio, Lianyungang Huawei Electronic Group, Micron Semiconductor, Micron Technology, Motorola, Nantong Fujitsu Micro, Nantong Huada Microelectronics, National Semiconductor (Suzhou), NFME, Ningbo Kangqiang Electronics, Nokia, NXP, Panasonic, Payton Technology, Qimonda (Suzhou), Qingdao Hisense Communications, Renesas Technology, RF Micro Devices, Sanyo Semiconductor, SGNEC, Shanghai Electronics Development Holding Group, Shanghai Kai Hong Electronics, Shanghai Matsushita Semi, Shanghai Simconix, Shenzhen STS Micro, SHIC, Silan Microelectronics, Siliconware (Suzhou), SIMS, Sino-Microelectronics, SMIC, SMSC, Stats ChipPAC, STMicro, Suzhou Hanlin, Suzhou Kinglong, Tianshui Huatian Microelectronics, Toshiba Semiconductor, Unisonic Technologies, Wuxi China Resources Huajing Microelectronics, Wuxi-KEC Semiconductor, Xiamen Union Development, Xiamen Yonghong Electronic, Yangzhou Jinglai Electronics, Yangzhou JingShi High Technology

List of Tables

• Table 1 China' s Top-ten Semiconductor Packaging and Testing Companies in 2006
• Table 2 China' s Main Packaging and Testing Makers in 2007
• Table 3 Freescale' s R&D and Production Locations
• Table 4 Qimonda AG' s R&D and Production Locations
• Table 5 STMicro' s R&D and Production Locations in China
• Table 6 Matsushita Electric Industrial' s Packaging and Testing Facilities in China
• Table 7 Intel' s R&D and Production LocationsI in China

List of Figures

• Figure 1 Chinese Semiconductor Packaging and Testing Industry Revenue, 2002 - 2006