組込みプロセッシングにおけるPowerPCの市場機会

Abstract

Embedded processing covers microcontrollers, microprocessors, ASICs, ASSPs and FPGAs and encompasses a broad range of applications across each of the main end-use sectors, from cell phones and automotive entertainment to media players and TVs & set-top boxes.

The embedded processing industry is a complex market to understand, with designers having a myriad of options to consider when choosing a processor platform to use in their design. Factors governing choice typically include processor performance, power consumption, cost, development tools and availability of supply. Suppliers compete using proprietary or industry standard processing architectures for design wins. This includes ARC, ARM, Coldfire/68K, FR, MIPS, PowerPC, ST20, SuperH, TriCore, V850, x86 and Xtensa.

This study focuses on understanding the current and future market for PowerPC-based MCUs/MPUs, ASICs/ASSPs and FPGAs, identifying which are the key applications for growth.

• One of a series of 3 reports on ARM, MIPS & PowerPC in Embedded Processing.
• Coverage of the market for PowerPC-based MCUs/MPUs, ASICs/ASSPs and FPGAs.
• Analysis of 20 application areas, providing detailed coverage of each end-use sector.
• Unit, revenue and average pricing (ASP) analysis for PowerPC-based MCUs/MPUs, ASICs/ASSPs and FPGAs in each application. Base year is 2006, with forecasts to 2012.
• Regional analysis of the market for PowerPC-based processors for each main end-use sector, segmented into Americas, Europe and Japan/Asia Pacific. Base year is 2006, with forecasts to 2012.
• Supplier market share estimates (revenues) for PowerPC-based processors in 2006.
• Highly quantitative analysis, with discussion summarized in short, easy to read bullet points.
• PDF and Excel delivery options available.

Colin Barnden is principal analyst for semiconductor research at Semicast. Prior to Semicast, he worked for 12 years at IMS Research, rising to the position of Senior Research Director of its Semiconductor Research Group and responsible for analyst coverage on the analog/mixed signal, optoelectronic and embedded processing industries. Colin also set-up and established IMS Research' s Automotive Electronics Group. During his tenure, Colin authored dozens of reports and became a well respected semiconductor industry analyst. He holds a B.S. in Electronic Engineering from Aston University, England.

Section 1 - Executive Overview

• Key Point Conclusions

Section 2 - Definitions

Section 3 - PowerPC in Embedded Processing by Application

• 3.1 Under-the-hood Electronics
• 3.2 Automotive Entertainment Systems
• 3.3 Cellphones & Communicators
• 3.4 Customer Premises Equipment
• 3.5 Wired Communications Infrastructure
• 3.6 Wireless Communications Infrastructure
• 3.7 Compute Platforms
• 3.8 HDDs & Storage Systems
• 3.9 Office Equipment & Computer Peripherals
• 3.10 Wired Games Consoles
• 3.11 Handheld Games Consoles
• 3.12 Media Players/MP3 Players
• 3.13 Cameras & Camcorders
• 3.14 TVs & Set-top Boxes
• 3.15 DVD Recorders & Players
• 3.16 Other Consumer Electronics
• 3.17 Industrial Automation & Drives
• 3.18 Medical Electronics
• 3.19 Chip Cards & Payment Processing
• 3.20 Other Industrial Electronics

Section 4 - PowerPC in Embedded Processing by Geographic Region

Section 5 - PowerPC-based MCUs/MPUs

Section 6 - PowerPC-based ASICs/ASSPs

Section 7 - PowerPC-based FPGAs

• Table 1.1 - PowerPC in Embedded Processing by Application - Revenue Summary
• Table 1.2 - PowerPC in Embedded Processing by Application - Unit Summary Applications
• Table 1.3 - PowerPC in Embedded Processing - Product Summary
• Table 1.4 - The World Market for PowerPC-based Processors by Geographic Region
• Table 1.5 - Worldwide Market Share Estimates for Suppliers of PowerPC-based Processors in 2006
• Table 2.1 - Definitions of Embedded Processing Product Categories
• Table 2.2 - Definitions of Applications
• Table 3.1 - Opportunities for PowerPC-based Processors in Automotive Under-the-hood Electronics
• Table 3.2 - Revenue Forecast for PowerPC-based MCUs/MPUs in Automotive Under-the-hood Systems
• Table 3.3 - PowerPC-based Processors in Automotive Entertainment Systems
• Table 3.4 - PowerPC-based Processors in Cellphones & Communicators
• Table 3.5 - PowerPC-based Processors in Customer Premises Equipment
• Table 3.6 - PowerPC-based Processors in Wired Communications Infrastructure
• Table 3.7 - PowerPC-based Processors in Wireless Communications Infrastructure
• Table 3.8 - PowerPC-based Processors in Compute Platforms
• Table 3.9 - PowerPC-based Processors in HDDs & Storage Systems
• Table 3.10 - PowerPC-based Processors in Office Equipment & Computer Peripherals
• Table 3.11 - PowerPC-based Processors in Wired Games Consoles
• Table 3.12 - PowerPC-based Processors in Handheld Games Consoles
• Table 3.13 - PowerPC-based Processors in Media Players/MP3 Players
• Table 3.14 - PowerPC-based Processors in Cameras & Camcorders
• Table 3.15 - PowerPC-based Processors in TVs & Set-top Boxes
• Table 3.16 - PowerPC-based Processors in DVD Recorders & Players
• Table 3.17 - PowerPC-based Processors in Other Consumer Electronics
• Table 3.18 - PowerPC-based Processors in Industrial Automation & Drives
• Table 3.19 - PowerPC-based Processors in Medical Electronics
• Table 3.20 - PowerPC-based Processors in Chip Cards & Payment Processing
• Table 3.21 - PowerPC-based Processors in Other Industrial Electronics
• Table 4.1 - The World Market for PowerPC-based Processors by Geographic Region
• Table 4.2 - The Americas Market for PowerPC-based Processors by End-Use Industry
• Table 4.3 - The EMEA Market for PowerPC-based Processors by End-Use Industry
• Table 4.4 - The Japan/Asia Pacific Market for PowerPC-based Processors by End-Use Industry
• Table 5.1 - PowerPC-based MCUs/MPUs in Embedded Processing by Application - Revenue Summary
• Table 5.2 - PowerPC-based MCUs/MPUs in Embedded Processing by Application - Unit Summary
• Table 6.1 - PowerPC-based ASICs/ASSPs in Embedded Processing by Application - Revenue Summary
• Table 6.2 - PowerPC-based ASICs/ASSPs in Embedded Processing by Application - Unit Summary
• Table 7.1 - PowerPC-based FPGAs in Embedded Processing by Application - Revenue Summary
• Table 7.2 - PowerPC-based FPGAs in Embedded Processing by Application - Unit Summary

• Figure 1 - Revenue Summary by End-use Industry
• Figure 2 - Unit Summary by End-use Industry
• Figure 3 - Revenue Summary by Product Type
• Figure 4 - Unit Summary by Product Type
• Figure 5 - Revenue Analysis by Geographic Region
• Figure 6 - Americas Revenue Summary by End-use Industry
• Figure 7 - EMEA Revenue Summary by End-use Industry
• Figure 8 - Japan/Asia Pacific Revenue Summary by End-use Industry
• Figure 9 - PowerPC-based MCUs/MPUs in Embedded Processing (Revenue Summary by End-use Industry)
• Figure 10 - PowerPC-based ASICs/ASSPs in Embedded Processing (Revenue Summary by End-use Industry)
• Figure 11 - Opportunities for PowerPC-based FPGAs in Embedded Processing (Revenue Summary