【 英文市場調査報告書 】
世界の半導体ウエハ製造設備の建設動向データベース:Fab Construction Monitor
Fab Construction Monitor
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| 商品コード : 52256 |
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| 出版日 : 2008/08 |
| 発行 : SEMI |
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※この商品は英文にてご提供いたします。 |
AbstractFab construction spending, 2 years of data, including forecast for next 6 quarters
The Fab Construction Monitor is a subset of the full version of FabFutures and
focuses specifically on fab construction expenditures. Fab Construction
Monitor contains over 100 records and features details by company in over 27
categories covering past two quarters and projecting the next six quarters.
This Excel-formatted database is conveniently delivered electronically.
Benefits:
With the Fab Construction Monitor, you can conduct more efficient market
research, identify target customers, and analyze quarterly fab capacity trends
more easily.
An annual subscription includes:
- Construction spending listing two previous quarters and the next 6
quarters data
- Lists all fabs under construction or planned
- Planned capacity, equipment spending, geometries and products
- Includes dates for groundbreaking, equipment move-in, first silicon and
production
Featuring the following detailed worksheets:
- Summary
- Graphs
- Company Detail
- Fabs by Region
- Special Technology
- All Construction Spending
- Begin Construction
- Equipping
- 1st Silicon
- Production
- Definitions page
Methodology:
Fab Construction Monitor is compiled from publicly available information,
including capital spending plans, announced fab plans and ream schedules. SEMI
verifies this information by making up to 50 inquiries a week and periodic
visits to semiconductor companies.
Table of Contents
- Company Name and Ownership: The database includes listing of
global semiconductor wafer fabs including the following fabs: Intel, AMD,
Chartered Semiconductor, Crolles 2, Flash Alliance, Hynix, IM Flash, HHNEC,
MagnaChip, Powerchip, ProMOS, Qimonda, Renesas, Samsung, SemIndia, SMIC, Texas
Instrument, Toshiba, TSMC, UMC,X-Fab
- Fab Name
- City/State/Prefecture/Province/Country/Region
- Probability
- Status
- Fab Types
- Project Types
- Product Types: Analog, Discrete, Foundry, Logic, Memory, MEMS, MPU,
others
- Technology
- Wafer Size: 12" (300 mm), 8" (200 mm), 6" (150 mm), 4" (100 mm),
2" (50
- mm)......
- Geometry : (45nm, 65nm, 90nm,.......)
- Capacity/Month
- Total announced Cost and Costs for Construction and Equipment
- Construction Costs
- Project Milestone Dates for Start Construction, Equipping, 1st Silicon and
Production
- Comments
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※この商品は英文にてご提供いたします。 |
|
【 英文市場調査報告書 】
世界の半導体ウエハ製造設備の建設動向データベース:Fab Construction Monitor
Fab Construction Monitor
出版日 : 2008/08
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換算による円建てのご請求書にて承ります。
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商品コード : 52256 |
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