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【 英文市場調査報告書 】

世界の半導体ウエハ製造設備の建設動向データベース:Fab Construction Monitor

Fab Construction Monitor

商品コード : 52256 SEMI
出版日 : 2008/08
発行 : SEMI
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価格情報
概要 原文目次
※この商品は英文にてご提供いたします。

Abstract

Fab construction spending, 2 years of data, including forecast for next 6 quarters

The Fab Construction Monitor is a subset of the full version of FabFutures and focuses specifically on fab construction expenditures. Fab Construction Monitor contains over 100 records and features details by company in over 27 categories covering past two quarters and projecting the next six quarters. This Excel-formatted database is conveniently delivered electronically.

Benefits:

With the Fab Construction Monitor, you can conduct more efficient market research, identify target customers, and analyze quarterly fab capacity trends more easily.

An annual subscription includes:

  • Construction spending listing two previous quarters and the next 6 quarters data
  • Lists all fabs under construction or planned
  • Planned capacity, equipment spending, geometries and products
  • Includes dates for groundbreaking, equipment move-in, first silicon and production

Featuring the following detailed worksheets:

  • Summary
  • Graphs
  • Company Detail
  • Fabs by Region
  • Special Technology
  • All Construction Spending
  • Begin Construction
  • Equipping
  • 1st Silicon
  • Production
  • Definitions page

Methodology:

Fab Construction Monitor is compiled from publicly available information, including capital spending plans, announced fab plans and ream schedules. SEMI verifies this information by making up to 50 inquiries a week and periodic visits to semiconductor companies.

Table of Contents

  • Company Name and Ownership: The database includes listing of global semiconductor wafer fabs including the following fabs: Intel, AMD, Chartered Semiconductor, Crolles 2, Flash Alliance, Hynix, IM Flash, HHNEC, MagnaChip, Powerchip, ProMOS, Qimonda, Renesas, Samsung, SemIndia, SMIC, Texas Instrument, Toshiba, TSMC, UMC,X-Fab
  • Fab Name
  • City/State/Prefecture/Province/Country/Region
  • Probability
  • Status
  • Fab Types
  • Project Types
  • Product Types: Analog, Discrete, Foundry, Logic, Memory, MEMS, MPU, others
  • Technology
  • Wafer Size: 12" (300 mm), 8" (200 mm), 6" (150 mm), 4" (100 mm), 2" (50
  • mm)......
  • Geometry : (45nm, 65nm, 90nm,.......)
  • Capacity/Month
  • Total announced Cost and Costs for Construction and Equipment
  • Construction Costs
  • Project Milestone Dates for Start Construction, Equipping, 1st Silicon and Production
  • Comments
概要 原文目次
※この商品は英文にてご提供いたします。
【 英文市場調査報告書 】
世界の半導体ウエハ製造設備の建設動向データベース:Fab Construction Monitor
Fab Construction Monitor
出版日 : 2008/08
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価格

※ドル建て価格の商品のお支払いは、銀行レート (TTS: 107.78) 換算による円建てのご請求書にて承ります。

US $ 1,100 換算 -> ¥ 118,558 (税抜) Excel Database by E-mail (Single Copy)
商品コード : 52256