SMD（表面実装デバイス）装着の最新動向

Abstract

This research service focuses on the latest trends in surface mount device (SMD) placement system and its relevant technologies.

Table of Contents

1 EXECUTIVE SUMMARY

• Scope and Methodology
  • Scope
  • Methodology
• Research Overview and Key Findings
  • Research Overview
  • Key Findings

2 SURFACE MOUNT DEVICE ASSEMBLY

• Technology Snapshot
  • The Emergence of SMD Assembly Process
  • Overview of the SMD Assembly Process
• SMD Performance and Components
  • Factors that Influence SMD Assembly
  • SMD Assembly Components

3 SMD PLACEMENT SYSTEMS

• Types of SMD Placement Designs
  • Overview
  • Turret-Style Systems
  • Pick and Place Systems
  • Multistation Systems
• Summary and Key Companies
  • Summary
  • Key Players in this Sector

4 EMERGING TRENDS AND ISSUES IN SMD PLACEMENT

• Placement Technology
  • Modular Design Using Parallel Placement
  • Vision Systems
  • Placement Optimization Issues
  • Placement Head Technology
• Related Technologies and Issues
  • Standardization
  • Supporting Miniaturization (01005)
  • New Packaging and Board Technologies
  • Problems of Lead-Free Solder
  • Rework Technologies

5 KEY DEVELOPMENTS RELATED TO THE SMD SECTOR

• Global Developments in Placement Machine Technology
  • Hybrid Pick and Place Machine--Netherlands
  • Handling Capability and Speedpack Upgrade to a Series--Netherlands
  • New MG-2 Chipshooter for M Series--Netherlands
  • Upgrades in X Series--Netherlands
  • Linear Motor Driven AdVantis XS--USA
  • Lightning Placement Technology--USA
  • Gold Dual-Lane and Black Midrange Electric Tape Feeder--USA
  • World' s First Parallel 2D/3D Inspection--Germany
  • New D-Series Placement Machines--Germany
  • Boosting the Capability of Siplace through Acquisitions--Germany
  • Linear Motors in High Speed HLX Series--Germany
• Global Developments Affecting Placement Technology
  • StencilQuick Rework Solution--USA
  • Fully-Hermetic Plastic Packaging--USA
  • Assembléon and Yamaha Intelligent Machinery Partnership--Germany and Japan
  • New Solder Ball Feeder Equipment--UK

6 KEY CONTACTS AND SELECTED PATENTS

• Key Contacts
  • Industry
  • Academics
• Selected Patents
  • Patents I
  • Patents II

7 DECISION SUPPORT DATABASE

• Decision Support Database Tables
  • World OLED Revenues (2002 to 2012)
  • Global Semiconductor and Semiconductor Equipment Market (2002-2012)
  • Percentage of Electronic Components Contribution to Electronics Industry (2002-2012)
  • Consumer Electronics Contribution to Electronics Industry--2002 to 2012
  • Global HB-LED Sales for Lighting (USD Million) 2002-2013