熱伝導性ポリマーの技術動向分析

Abstract

This research service profiles important emerging developments and trends related to thermally conductive polymers for thermal management applications across different sectors including electronics, appliances, food, medical and so on.

Table of Contents

1 EXECUTIVE SUMMARY

• Scope and Methodology
  • Scope
  • Methodology
• Overview and Study Highlights
  • Overview
  • Study Highlights

2 TECHNOLOGY PRIMER

• Introduction to TCP
  • What are TCPs?
  • Significance of TCP Materials
• Different TCP Materials
  • Polypropylene
  • Acrylonitrile Butadiene Styrene
  • Polycarbonate
  • Nylon
  • Liquid Crystalline Polymers
  • Polyphenylene Sulfide
  • Polyetheretherketone

3 CLASSIFICATION AND APPLICATIONS OF THERMALLY CONDUCTIVE POLYMER COMPOUNDS

• Thermally Conductive Polymer Compounds Variants
  • Thermal Conductive Greases
  • Thermal Conductive Adhesives
  • Thermally Conductive Tapes
  • Thermal Conductive Coatings
  • Thermally Conductive Encapsulants
• Applications
  • Electronics and Lighting Sectors
  • Appliances
  • Fibers and Fabrics
  • Medical
  • Food Contact Material and Processing

4 KEY INNOVATIONS/BREAKTHROUGHS

• Key Innovations/Breakthroughs in the North American Region
  • Improved Dispersion of Aluminum Nitride Particles in Epoxy Resin by Adsorption of Two-Layer Surfactants
  • Advanced Thermal Interface Materials
  • A New Line of Thermally Conductive Compounds for Thermal Management Systems
  • Effect of Single-Walled Carbon Nanotube Purity on the Performance of Nanotube-Based Composites for Thermal Management
  • Modification of Polymers to Provide Thermal Solutions in Heat Generating Applications
  • High-Thermal Conductivity in Organic Adhesives
  • Liquid Crystalline Polymer for Preparation and Storage of Foodstuff
  • Other Key Developments
• Key Innovations/Breakthroughs in the European Region
  • Thermally Conductive Interface Materials-Achieving Optimal Thermal Discharge
  • Thermally Conductive Adhesives for Microelectronics--Barriers of Heat Transport
  • Temperature Dependent Thermal Conductivity of Carbon Nanotube/Epoxy Composites
  • Reduction of Energy Consumption by Using High-Performance Thermoplastics in Light Emitting Devices
• Key Innovations/Breakthroughs in the Asia Pacific Region
  • Novel Heat-Conductive Composite Silicone Rubber and its Properties
  • Thermal Characterization of Thermally Conductive Underfill for a Flip-Chip Package Using Novel Temperature Sensing Technique
  • Thermally Conductive Silicone Rubber Sheet with Super-Low Hardness

5 TECHNOLOGY ADOPTION FACTOR ANALYSIS

• Technology Drivers
  • Advanced Properties of Thermally Conductive Polymers
  • Metal or Ceramic Filler Content Makes Polymers Better
  • Easy Processibility of Custom-Made Products
  • Heat Sink Technology and Packaging of Microprocessor Components
  • Energy Losses
  • Thermal Modeling and Prototyping
  • Low-CTE Mismatch in IC Packages
• Industry Challenges
  • Elevated Temperature--A Concern for Passive Component Manufacturers
  • Silicone-Based Materials Technology
  • Lack of New Materials
  • Cost Considerations in Manufacturing Process
• Trends
  • Current Trends
  • Future Trends
• Application Trend Analysis
  • Introduction
  • Electronics Sector
  • Automotive Sector
  • Aerospace Sector

6 KEY PATENTS AND CONTACTS

• Recent Patents
  • US Patents
  • Other Patents
• Contacts
  • Corporates
  • Universities

7 DECISION SUPPORT DATABASE

• Critical Reference Tables
  • Printed Circuit Board (PCB) Sales--World (2002 to 2012)
  • Office Equipment Contribution to Electronic Industry (2002 to 2012)
  • Semiconductor Market and Semiconductor Equipment Market (2002 to 2012)