Abstract
This report examines present and future markets for Embedded Integrated
Computer Systems (EICSs) in military/aerospace/defense applications on a
global basis. The study includes:
- Market sizes and forecasts through the year 2010
- Analysis of market and technology trends
- User data on trends, expectations, and product preferences
- Strategic recommendations
Table of Contents
I EXECUTIVE SUMMARY
- GENERAL OVERVIEW
- GEOGRAPHICAL DISTRIBUTION
- MILITARY/AEROSPACE MARKET SEGMENTS
- SYSTEM ARCHITECTURES
- USER SURVEY RESULTS
- SELECTED RECOMMENDATIONS
- LEADING VENDORS
II SCOPE AND METHODOLOGY
- SCOPE
- Definition of Terms
- Segmentation
- Other Report Content
- METHODOLOGY
III INDUSTRY STRUCTURE
- INDUSTRY PARTICIPANTS
- SEGMENTATION MODEL
- SYSTEM CONFIGURATIONS
- SALES ORGANIZATIONS
- CUSTOMER CLASSES
- ROHS
IV MARKET SIZE, SEGMENTATIONS, AND FORECASTS
- TOTAL EICS MILITARY/AEROSPACE MARKET
- MERCHANT EICS MILITARY/AEROSPACE MARKET
- Unit Volumes & Pricing
- Geographic Distribution
- Sales/Distribution Channels
- Customer Classes
- Market Segments
- Applications
- System Configurations
- System Architectures
- Passive Backplane Bus Architectures
- Active Backplane Motherboard Form Factors
- Enclosure/Mounting Style
- CPU Classes
- CPU Types
- Number of Processors
- Services Offered
V USER REQUIREMENTS AND TRENDS
- INTRODUCTION
- METHODOLOGY
- FOCUS ON MILITARY APPLICATIONS
- SOURCES FOR EMBEDDED INTEGRATED COMPUTER SYSTEMS(EICS)
- HARDWARE COMPUTER PLATFORM ARCHITECTURES
- Passive Backplane Architectures
- Active Backplane Architectures
- Stackable Architectures
- TYPES OF CONFIGURATIONS
- ENCLOSURES
- Passive Backplane
- Active Backplane
- KEY TECHNOLOGIES
- MICROPROCESSOR USE
- SINGLE AND MULTIPLE PROCESSORS
- SOFTWARE OPERATING SYSTEMS
- SUBSYSTEM CAPABILITIES
- SYSTEM FAILURES
- ETHERNET CONNECTIVITY
- TYPES OF COOLING
- SUPPORT SERVICES
- UPGRADES AND MAINTENANCE
- PRODUCT FEATURES AND PERFORMANCE
- COMMERCIAL CONSIDERATIONS
- SOURCES FOR INFORMATION
VI COMPETITIVE ANALYSIS
- MILITARY/AEROSPACE EICS VENDOR MARKET SHARES
- MILITARY/AEROSPACE EICS GEOGRAPHICAL VENDOR MARKET SHARES
- MILITARY/AEROSPACE EICS PASSIVE BACKPLANE VENDOR MARKET SHARES
- MILITARY/AEROSPACE EICS ENCLOSURE TYPE VENDOR MARKET SHARES
VII STRATEGY AND RECOMMENDATIONS
- GENERAL
- Specific Recommendations
- SYSTEM ARCITECTURES
- Specific Recommendations
- MICROPROCESSORS
- SERVICES
- Specific Recommendations
VIII VENDOR PROFILES
- BAE SYSTEMS, PLC
- THE BOEING COMPANY
- CURTISS WRIGHT CONTROLS EMBEDDED COMPUTING
- DRS TECHNOLOGIES, INC.
- EUROTECH SPA
- GE FANUC EMBEDDED SYSTEMS
- GENERAL DYNAMICS C4 SYSTEMS
- KONTRON AG
- L-3 COMMUNICATIONS CORPORATION
- LOCKHEED MARTIN CORPORATION
- MERCURY COMPUTER SYSTEMS
- NATIONAL INSTRUMENTS
- RAYTHEON COMPANY
APPENDIX: VENDOR LIST
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