欧州のIC製造・その他関連施設の動向

Abstract

Europe accounts for more than 280 production and research fabs active in one or more of the investigated technology fields.

In this report details are given about the specific facilities:

• ICs
• MEMS
• Packaging
• Power Devices
• R&D institutes
• Compound Semiconductors

Product objectives

The objectives of “IC Europe” are:

• To understand, based on facts, the complex and diverse collection of semiconductor equipment and material suppliers' customers.
• To create a tool for the equipment and material suppliers and others to assess business opportunities in the European market
• To enable suppliers of semiconductor industry to detect new opportunities in the European Semiconductor market.

Product overview

This comprehensive report details fab locations, contacts, products, technologies, manufacturing facilities, and financial information. The covered geographical area includes 48 countries such as the European Union, Eastern European countries, Turkey, Morocco, Israel, and Russia.

Key Product Features

The database includes:

• ICs (Memory, Logic, Analog and mixed signal, ASICs, Other IC devices)
• MEMS (Ink jet head; Sensors: pressure, inertial, IR Image, specific chemicals & gasses; optical MEMS; RF MEMS; other MEMS devices)
• Compound Semiconductors (GaAs, SiC, GaN, InP based devices)
• Power devices
• Packaging (Discrete packaging, Zero and first-level packaging, Wafer Level Packaging, other packaging techniques such as 3D)
• Major R&D labs

The report includes:

• Executive summary
• Statistical analysis of the breakdown of corporate and manufacturing sites by size, geography, technology, and products
• Trends analysis for products and manufacturing
• Summary of key points that includes key concerns and initiatives related to the development, purchase and use of equipment and materials.

The accompanying database includes detail for the manufacturing sites*:

• Name of the company, including Website
• Size (number of employees, sales figures for 2005)
• General activities (applications, devices and markets)
• Addresses of the different manufacturing sites in Europe
• Per manufacturing site:
  • Technology(s) implemented
  • Capacity (wafer starts per week)
  • Capacity forecast
  • Size and type of the clean room
• Full coordinates of contact point (name, title, email and/or telephone, location)

Why buy this report

• By acquiring this new report and database, you will have an access to a fully detailed list of European fabs of Integrated Circuit, Packaging, MEMS Power Devices, and R&D centres.
• The Database is a really helpful tool to classify, extract and choose company name and related information.
• The accompanying report will help you to get a better understanding of the European fab market and trends: global sales, products and technology breakdown, future fab opening, 300 mm based wafer fab.

Who should buy this report

• The report & database is of great interest for equipment and material suppliers in order to prepare marketing approach, to forecast opening and expansion fab and to contact the right person within an organisation.
• Report and database are also useful for devices manufacturer to look at production and foundry partners or packaging services companies.

Companies described in the database

3DPlus, ABB Semiconductor, ACREO, AEMtec, Alcatel Alenia Space Italia, AMD, Analog Devices Inc, Atmel, AMS, Boehringer Ingelheim, Bookham Technology Ltd., Colibrys, COM, CSEM, Cube Optics, DALSA Nederland B.V., Dynex Semiconductor, ELMO Semi-conductors, Fraunhofer, Freescale Semiconductor Inc., GE Infrasctructure Sensing, Hymite, IMEC, Infineon Technologies AG, LETI, Microtech, NEC Semiconductors, Olivetti I Jet, Osram Opto Semiconductors GmbH&Co, Philips Semiconductors, Qinetiq, Robert Bosch, Sensitec, Sensonor, Silex Microsystems, STMicroelectronics...

Table of Contents

• Executive summary
• General trends for the micro-electronics industry: market and technologies worldwide and in Europe
  • Semiconductor devices
  • Power devices
  • MEMS/MST
  • Compound semiconductor devices
  • Packaging
  • R&D
• Statistical analysis for European fabs
  • Manufacturing locations
  • Technologies
  • Products
  • Wafer size
  • Capacity planning and future needs/investments
• Conclusions

Executive summary

Analysis of European fabshas shown that:

• There are 281 production fabsin Europe for ICs, MEMS, power devices, compound semiconductors and packaging. 34 have 2 or more activities (ICs and MEMS, ICs and power devices ...)
• For ICs:
  • Europe accounts for 12% of worldwide 8' ' eq. wspw
  • STM and Infineon are among the TOP 10 worldwide SC companies sales
  • Germany, France and UK have more than 50% of the total number ofIC fabsin Europe
• For power devices:
  • Europe accounts for less than 30% of the world production
  • The fabsare evenly distributed through Europe. UK has the highest number of fabs(6 out of 31 fabsin total)
  • STM ranks as the 5th worldwide player in power device sales
• For MEMS:
  • Europe accounts for 16% of worldwide sales
  • Germany has the highest number of MEMS fabs(25 out of 67 fabsin total)
  • STM and Bosch are respectively 3rd and 4th MEMS players in revenue
• For packaging:
  • There are 50 fabsin Europe
  • There is no large OSAT player in Europe (most of them are in Asia)
• For compound semiconductors:
  • For compound semiconductors, the activity is mainly localized inWestern Europe and Israel (29 fabsin total).
  • There are two large players involved in LEDs: Osramand Philips/Lumileds(but no facility in Europe for the latter)
• For R&D:
  • There are 27 large R&D public institutes
  • Europe has three world-class semiconductor R&D centresof semiconductor excellence: IMEC, Letiand Fraunhofer
  • In 2005, R&D spending by European IC companies stands at:
    • STM: $6.4B (17% of sales)
    • Infineon: $6.3B (19% of sales)
• There are seven 12”wafer fabsin Europe and 11 sub-90 nm fabs(including one 45 nm Intel fabin Leixlip, Ireland)
• For ICs, most of the production is done on 8”wafers:
  • MPUs, DRAMsand Flash are processed on 8”and 12”wafers→ 60% of MPUs, DRAMsand Flash are processed on 8”
  • For MEMS and Power Devices, most of the production is done on 4”and 6”wafers (no 8”wafer line in production today for MEMS in Europe)
• ICs represent 74% of total wspm(231 Fabsrepresent a total of 2.04 million of wspm).
• European fabsrepresent a total area of 682,442 m2(corrected data, taking into account combined activities).
  • IC represent almost 75% of the total clean room surface
• Europe employs about 65,000 people related to fabmanufacturing activity.
  • IC manufacturing is the major employer with about 51% of total European fabemployment.
• CMOS, biCMOSand bipolar are the most used technologies.