世界のMEMS/マイクロシステム市場：市場・市場機会分析

Abstract

MEMS systems incorporate MEMS devices and include products such as automobile airbag systems, display systems and inkjet cartridges. The worldwide MEMS systems market reached $40 billion in 2006, and is expected to rise to $56 billion by 2009 and $72 billion by 2011, for a compound annual growth rate (CAGR) of about 12% over the five-year period.

• Globally the MEMS device market was $5.9 billion last year and is forecast to grow to $10.8 billion in 2011, with a 13% CAGR.
• The MEMS equipment market was $646 million worldwide in 2006, and is expected to expand to $838 million in 2009 and $999 million in 2011. The five-year CAGR forecast for MEMS equipment is 9%.
• MEMS materials can be divided into substrates and chemicals and other materials.Together these markets totaled $433 million in 2006 and are forecast to be $806 in 2011.Total materials are expected to grow at a five-year CAGR of 13% through 2011.

The MEMS industry is highly fragmented with a large number of device manufacturers worldwide in a wide variety of application fields. Many start-ups and small and medium-sized companies participate in the industry.

• The top 30 MEMS device manufacturers accounted for about 88% of MEMS device sales in 2006.
• No one supplier has reached the billion dollar sales mark as of yet, and average revenue for a top 30 manufacturer is about $171 million.

A key theme for MEMS makers today is the move from sensors to integrated modules.There are several different strategies that could be used to get there.

Many new start-up companies now follow a "fab-light" strategy and rely on the existing MEMS or semiconductor-manufacturing infrastructure.This is driving evolution in the industry, especially increased outsourcing, growing involvement of IC manufacturers, and the growth of MEMS foundries and contract manufacturers.

A large percentage of MEMS manufacturing is outsourced. Many MEMS contract manufacturers also make captive MEMS products. In general, MEMS foundry sales are growing faster than the overall MEMS device market, a sign of the health of the MEMS industry and expansion of MEMS processing.

North America is the largest MEMS-producing region, but its share is expected to decrease over the next few years. Japan is the next largest MEMS producing region, and is expected to remain stable in the near-term. In Europe, only three companies are producing MEMS in volume, and the relative share is expected to fall in the coming years. Singapore is also a significant manufacturing location for MEMS, but this is expected to change as no new MEMS will be manufactured in Singapore, and STMicroelectronics will produce inkjet heads for HP in the U.S.

MEMS substrate materials are the largest materials segment and include silicon, quartz, glass, polymers and others.The total MEMS substrate market is forecast to grow from $264 million in 2005 to $570 million by 2010, for a CAGR of over 17 percent over the five-year period. Packaging coating materials (SU-8) are a relatively new materials market, but are forecast to grow to $3 million in 2010, for a CAGR of 50 percent over the five-year period.

Table of Contents

EXECUTIVE SUMMARY

• Market
• Applications
• Materials and Manufacturing Technology

1 INTRODUCTION

• 1.1 Methodology
• 1.2 Definition of Terms

2 MEMS MARKET OVERVIEW

• 2.1 MEMS Device Market and Forecast
• 2.2 MEMS Equipment Market and Forecast
• 2.3 MEMS Material Market and Forecast

3 MEMS APPLICATIONS-TRENDS AND OPPORTUNITIES

• 3.1 Inkjet Heads
  • 3.1.1 Overview
  • 3.1.2 Market Outlook
  • 3.1.3 Key Players
  • 3.1.4 Application and Technology Trends
  • 3.1.5 Manufacturing Trends
• 3.2 Pressure Sensors
  • 3.2.1 Overview
  • 3.2.2 Market Outlook
  • 3.2.3 Key Players
  • 3.2.4 Application and Technology Trends
  • 3.2.5 Manufacturing Trends
• 3.3 Silicon Microphones
  • 3.3.1 Overview
  • 3.3.2 Market Outlook
  • 3.3.3 Key Players
  • 3.3.4 Application and Technology Trends
  • 3.3.5 Manufacturing Trends
• 3.4 Accelerometers
  • 3.4.1 Overview
  • 3.4.2 Market Outlook
  • 3.4.3 Key Players
  • 3.4.4 Application and Technology Trends
  • 3.4.5 Manufacturing Trends
• 3.5 Gyroscopes
  • 3.5.1 Overview
  • 3.5.2 Market Outlook
  • 3.5.3 Key Players
  • 3.5.4 Application and Technology Trends
  • 3.5.5 Manufacturing Trends
• 3.6 Digital Micromirror Display and Other MOEMS
  • 3.6.1 Overview
  • 3.6.2 Market Outlook
  • 3.6.3 Key Players
  • 3.6.5 Manufacturing Trends
• 3.7 Microfluidics
  • 3.7.1 Overview
  • 3.7.2 Market Outlook
  • 3.7.3 Key Players
  • 3.7.4 Application and Technology Trends
  • 3.7.5 Manufacturing Trends
• 3.8 RF MEMS
  • 3.8.1 Overview
  • 3.8.2 Market Outlook
  • 3.8.3 Key Players
  • 3.8.4 Application and Technology Trends
  • 3.8.5 Manufacturing Trends
• 3.9 Emerging MEMS
  • 3.9.1 Overview
  • 3.9.2 Energy Harvesting Devices
  • 3.9.3 Multi-Frequency Oscillator
  • 3.9.4 Silicon-Based Micro Motor
  • 3.9.5 Auto Focus and Micro Zoom

4 MATERIALS AND PROCESS TECHNOLOGIES-TRENDS AND OPPORTUNITIES

• 4.1 CMOS-MEMS Integration
• 4.2 Substrates
• 4.3 Lithography, Photoresists and Ancillaries
• 4.4 Wafer Bonding
• 4.5 Deposition and Etch
• 4.6 Anti-Stiction
• 4.7 Chemical Mechanical Planarization (CMP)
• 4.8 Packaging

5 APPENDICES

• 5.1 MEMS Equipment Suppliers by Segment
• 5.2 MEMS Materials Suppliers by Segmen
• 5.3 Companies Interviewed
• 5.4 List of Acronyms and Abbreviations
• 5.5 List of Figures and Tables

List of Figures and Tables

List of Figures

• Figure 2.1 The MEMS Supply Chain
• Figure 2.2 Top 30 MEMS Sales/Worldwide MEMS Sales 2003-2006
• Figure 3.1 Global Inkjet Head Market Forecast
• Figure 3.2 2006 Global Inkjet Head Market Share
• Figure 3.3 Global Pressure Sensor Market Forecast
• Figure 3.4 2006 Global Pressure Sensors Market Share
• Figure 3.5 Global MEMS Silicon Microphone Market Forecast
• Figure 3.6 Global Accelerometer Market Forecast
• Figure 3.7 Global Gyroscope Market Forecast
• Figure 3.8 Automotive Electronic Stability Functions and Components
• Figure 3.9 Global MOEMS Market Forecast
• Figure 3.10 Products Which Require A Compact Light Engine
• Figure 3.11 Light Engine Market Value
• Figure 3.12 Global Microfluidics Market Forecast
• Figure 3.13 Global RF MEMS Market Forecast
• Figure 3.14 Perpetuum Energy Harvester
• Figure 3.15 Typical Micro Fuel Cell Design
• Figure 3.16 SEM of MEMS First™WaferSiTime Products
• Figure 3.17 Liquid Lens in Operation
• Figure 4.1 Five Levels of Monolithic Integration
• Figure 4.2 MEMS in the Middle
• Figure 4.3 Beside IC or Pre-CMOS Process
• Figure 4.4 Above-IC Approach
• Figure 4.5 Integrated MEMS Market Forecast
• Figure 4.6 MEMS Substrate Market by Type
• Figure 4.7 Thick SOI Wafers for MEMS Devices
• Figure 4.8 Silicon Substrate Market by Diameter
• Figure 4.9 Photoresist and Ancillary Market Forecast
• Figure 4.10 Gases and Chemicals Market Forecast
• Figure 4.11 How Stiction Occurs
• Figure 4.12 Examples of Stiction on MEMS Devices
• Figure 4.13 Use of Supercritical CO2 and Self-Assembling Monolayer in the Device Process Flow
• Figure 4.14 SAM Materials for Anti-Stiction
• Figure 4.15 Packaging Coating Market Forecast
• Figure 4.16 SU-8 Applications

List of Tables

• Table 2.1 Top 30 MEMS Device Manufacturers
• Table 2.2 Top 12 MEMS Foundries
• Table 2.3 MEMS Device Markets and Forecasts by Application
• Table 2.4 MEMS Equipment Markets and Forecasts
• Table 2.5 MEMS Material Markets and Forecasts
• Table 3.1 Comparison of Nozzle Manufacturing Technologies
• Table 3.2 Accelerometer Forecast by Application
• Table 3.3 Gyroscope Forecast by Application
• Table 3.4 MOEMS Device Function and Applications
• Table 3.5 Microfluidics Food Chain
• Table 3.6 Current Microfluidics Markets
• Table 3.7 Microfluidic Application Drivers
• Table 3.8 Microfluidic Manufacturing Technologies
• Table 3.9 Emerging MEMS Products by Company
• Table 3.10 Global Emerging MEMS Market Forecast
• Table 3.11 Comparison of Competing AF/MZ Technologies
• Table 4.1 MEMS Substrate Market Forecast
• Table 4.2 Substrates by MEMS Device Type
• Table 4.3 Silicon Wafer Consumption by Diameter (in Thousands of Units)
• Table 4.4 Etching and Release of Sacrificial Layers in MEMS Devices
• Table 4.5 MEMS CMP Versus IC CMP
• Table 4.6 MEMS Packaging Requirements and Trends